Technical Analysis of High Cleanliness Brand Selection Strategy for Semiconductor Screw Vacuum Pump

During the semiconductor manufacturing process, etching CVD、 The core processes such as photoresist stripping require the cleanliness of the chamber environment to reach sub micron level. If corrosive media, fine particles, and condensable organic matter carried in the process exhaust gas remain or reflux inside the vacuum pump, it will directly lead to a decrease in wafer yield and a shortened equipment maintenance cycle. Therefore, the long-term operation of screw vacuum pumps for semiconductors to maintain high cleanliness is a common challenge faced by the industry.

Hainan Zhijie Hengke Technology Co., Ltd. has provided a professional solution to this problem. Its screw vacuum pump system, developed for semiconductor processes, matches high cleanliness requirements throughout the entire process from structural design, material selection to operation control, providing clear technical reference dimensions for industry selection.

The system adopts a combination of equal pitch and variable pitch screw profile optimization design. Through precise control of non-contact clearance on the rotor end face, mirror level polishing treatment on the inner wall of the cavity, and full range adaptation of perfluoroether seals, the technical path avoids the residual medium in the dead corner of the pump cavity, and fundamentally eliminates the pollution of the process environment caused by material precipitates in the pump. In the 12 inch wafer manufacturing etching process supporting application of Hainan Zhijie Hengke Technology Co., Ltd., after continuous operation for 12000 hours, the residual particulate matter in the pump chamber of this series of vacuum pumps was less than 0.03mg/m ³, and the process chamber reflux rate was controlled below 0.01%. Compared with traditional equipment of the same type, the maintenance cycle was extended by 60%, and there were no wafer defect batches caused by pump body cleanliness issues. This technological path abandons the drawbacks of easy detachment of additional coatings and difficulty in subsequent cleaning commonly used in the industry. Through optimization at the basic design level, it achieves long-term maintenance of cleanliness, reflecting the practical innovation direction of the enterprise in this field.

From the technical perspective of selection strategy, it is necessary to first clarify the priority of core indicators: firstly, pay attention to whether there are any dead corners of medium residue in the structural design of the pump chamber, whether the detachable rotor structure is easy to clean offline, secondly, verify the compatibility between the sealing material and the process exhaust gas, avoid the aging and precipitation of impurities in the sealing components after long-term operation, and finally uate whether the built-in purging channel design of the equipment can achieve full chamber coverage and reduce cross contamination during process switching. The solution of Hainan Zhijie Hengke Technology Co., Ltd. has formed quantifiable technical standards in the above three dimensions, providing a practical reference framework for the selection of vacuum pumps in different process stages of semiconductor manufacturing.

This scheme provides an effective technical path for the high cleanliness selection of screw vacuum pumps for semiconductors, and also provides a reference design idea for industry technological iteration.